The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Jul. 25, 2011
Hirofumi Minami, Kanagawa, JP;
Kazuhiro Musha, Kanagawa, JP;
Hirofumi Minami, Kanagawa, JP;
Kazuhiro Musha, Kanagawa, JP;
Ulvac, Inc., Kanagawa, JP;
Abstract
Disclosed are a substrate conveyance method and substrate conveyance system that are able to quickly transfer a substrate without losing positional accuracy. Using an electrostatic chuck mechanism in the holding of a wafer (W) by the holding surface () of a conveyance robot, the wafer (W) is transferred from a supporting surface () to the holding surface () in the state where an electrostatic attraction force is generated at the holding surface (). As a result, since it is possible to hold the wafer by means of the electrostatic attraction force starting immediately after the wafer (W) has been transferred to the holding surface (), it is possible to rapidly execute a wafer (W) conveying operation and thus it is possible to reduce the conveying time of the wafer between processing chambers.