The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8716209 B1

PDF
Full Text
Expired
Date of Patent:
May. 06, 2014

Filed:

Sep. 15, 2009
Applicants:

Yasushi Kobayashi, Kawasaki, JP;

Kouta Yoshikawa, Kawasaki, JP;

Yoshihiro Nakata, Kawasaki, JP;

Tadahiro Imada, Kawasaki, JP;

Shirou Ozaki, Kawasaki, JP;

Inventors:

Yasushi Kobayashi, Kawasaki, JP;

Kouta Yoshikawa, Kawasaki, JP;

Yoshihiro Nakata, Kawasaki, JP;

Tadahiro Imada, Kawasaki, JP;

Shirou Ozaki, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C11D 11/00 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); H01L 21/3105 (2013.01);
Abstract

The invention provides an agent for post-etch treating a silicon dielectric film, including: at least one nitrogen-containing substance selected from the group consisting of ammonium bases and amine compounds; an acid; and at least one silicon-containing compound containing silicon, carbon and hydrogen. According to the present invention, it becomes possible to suppress an increase in the dielectric constant of a silicon dielectric film caused by etching.


Find Patent Forward Citations

Kobayashi, Yasushi. (2014). Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device (U.S. Patent No. 8716209). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8716209

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