The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Feb. 25, 2008
Tetsuya Kamimura, Haibara-gun, JP;
Toshiyuki Saie, Haibara-gun, JP;
Masaru Yoshikawa, Haibara-gun, JP;
Tetsuya Kamimura, Haibara-gun, JP;
Toshiyuki Saie, Haibara-gun, JP;
Masaru Yoshikawa, Haibara-gun, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
The invention provides a polishing liquid for polishing a barrier layer of a semiconductor integrated circuit, the polishing liquid comprising: a diquaternary ammonium cation; a corrosion inhibiting agent; and a colloidal silica, wherein the pH of the polishing liquid is in the range of 2.5 to 5.0. According to the invention, a polishing liquid capable of achieving a superior barrier layer polishing rate, as well as suppressing the occurrence of scratching due to the agglomeration of solid abrasive grains can be provided.