The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
Oct. 20, 2010
Applicants:
Taiji Sakai, Kawasaki, JP;
Seiki Sakuyama, Kawasaki, JP;
Inventors:
Taiji Sakai, Kawasaki, JP;
Seiki Sakuyama, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction.
Sakai, Taiji. (2014). Method of manufacturing a printed wiring board (U.S. Patent No. 8713792). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8713792
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile