The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Feb. 22, 2011
Katsumi Kikuchi, Minato-ku, JP;
Shintaro Yamamichi, Minato-ku, JP;
Hideya Murai, Minato-ku, JP;
Kentaro Mori, Minato-ku, JP;
Yoshiki Nakashima, Minato-ku, JP;
Katsumi Kikuchi, Minato-ku, JP;
Shintaro Yamamichi, Minato-ku, JP;
Hideya Murai, Minato-ku, JP;
Kentaro Mori, Minato-ku, JP;
Yoshiki Nakashima, Minato-ku, JP;
NEC Corporation, Tokyo, JP;
Abstract
A wiring substrate in which a semiconductor element is built includes a semiconductor element; a peripheral insulating layer covering at least an outer circumferential side surface of this semiconductor element; and an upper surface-side wiring line provided on the upper surface side of the wiring substrate. The semiconductor element includes an internal terminal electrically connected to the upper surface-side wiring line on the upper surface side of the semiconductor element. This internal terminal includes a first conductive part exposed out of an insulating surface layer of the semiconductor element; an adhesion layer on this first conductive part; and a second conductive part on this adhesion layer. The adhesion layer covers an exposed surface of the first conductive part, and is formed on a portion of the insulating surface layer around the exposed surface of the first conductive part, and the adhesion layer extends around the outer side of an outer edge of this second conductive part so as to surround the second conductive part.