The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8710517 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 29, 2014

Filed:

Feb. 28, 2012
Applicants:

Ching-jen Pan, Hsinchu County, TW;

Wei-tai Cheng, Hsinchu County, TW;

Ming-hung Chen, Hsinchu County, TW;

Inventors:

Ching-Jen Pan, Hsinchu County, TW;

Wei-Tai Cheng, Hsinchu County, TW;

Ming-Hung Chen, Hsinchu County, TW;

Assignee:

Helio Optoelectronics Corporation, Hsinchu County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.


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