The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Dec. 06, 2010
Applicants:
Yasutaka Nakashiba, Kanagawa, JP;
Kenta Ogawa, Kanagawa, JP;
Inventors:
Yasutaka Nakashiba, Kanagawa, JP;
Kenta Ogawa, Kanagawa, JP;
Assignee:
Renesas Electronics Corporation, Kawasaki-Shi, Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/48 (2006.01); H01F 7/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A storage element is provided in a semiconductor chip, and an inductor and a driver circuit are provided in another semiconductor chip. An external terminal is a contact type terminal, and at least some external terminals are a power supply terminal and a ground terminal. A sealing resin layer is formed over a first surface of an interconnect substrate and seals the semiconductor chips but does not cover the external terminal. The inductor is formed at a surface of the semiconductor chip not facing the interconnect substrate.