The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2014

Filed:

May. 25, 2012
Applicants:

Clark Tu-cuong Nguyen, Oakland, CA (US);

Li-wen Hung, Berkeley, CA (US);

Inventors:

Clark Tu-Cuong Nguyen, Oakland, CA (US);

Li-Wen Hung, Berkeley, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01H 59/00 (2006.01); G01P 15/08 (2006.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
H01H 59/0009 (2013.01); G01P 15/0802 (2013.01); B81B 2203/0118 (2013.01); G01P 15/125 (2013.01); B81B 2201/0235 (2013.01);
Abstract

Etchant-free methods of producing a gap between two materials are provided. Aspects of the methods include providing a structure comprising a first material and a second material, and subjecting the structure to conditions sufficient to cause a decrease in the volume of at least a portion of at least one of the first material and the second material to produce a gap between the first material and the second material. Also provided are devices produced by the methods (e.g., MEMS and NEMS devices), structures used in the methods and methods of making such structures.


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