The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2014

Filed:

Mar. 16, 2012
Applicants:

Yukiteru Matsui, Kanagawa-ken, JP;

Masako Kodera, Kanagawa-ken, JP;

Hiroshi Tomita, Kanagawa-ken, JP;

Gaku Minamihaba, Kanagawa-ken, JP;

Akifumi Gawase, Kanagawa-ken, JP;

Inventors:

Yukiteru Matsui, Kanagawa-ken, JP;

Masako Kodera, Kanagawa-ken, JP;

Hiroshi Tomita, Kanagawa-ken, JP;

Gaku Minamihaba, Kanagawa-ken, JP;

Akifumi Gawase, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a method is disclosed for chemical planarization. The method can include forming a surface layer on a to-be-processed film having irregularity. The surface layer binds to or adsorbs onto the to-be-processed film along the irregularity to suppress dissolution of the to-be-processed film. The method can include planarizing the to-be-processed film in a processing solution dissolving the to-be-processed film, by rotating the to-be-processed film and a processing body while the to-be-processed film contacting the processing body via the surface layer, removing the surface layer on convex portions of the irregularity while leaving the surface layer on concave portions of the irregularity and making dissolution degree of the convex portions larger than dissolution degree of the concave portions.


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