The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 22, 2014

Filed:

Jul. 16, 2009
Applicants:

Hiroyuki Ochiai, Tokyo, JP;

Masaharu Yano, Tokyo, JP;

Kiyoshi Fujikake, Tokyo, JP;

Yoshio Takimoto, Tokyo, JP;

Yutaka Watanabe, Tokyo, JP;

Inventors:

Hiroyuki Ochiai, Tokyo, JP;

Masaharu Yano, Tokyo, JP;

Kiyoshi Fujikake, Tokyo, JP;

Yoshio Takimoto, Tokyo, JP;

Yutaka Watanabe, Tokyo, JP;

Assignee:

IHI Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is provided to cut a thin-walled member without causing chattering vibration, without using a chattering vibration preventing retainer, that performs the following: (A) preparing a material having much stock for obtaining a thin-walled material, (B) while rotating the material about a center axis, cutting the inner round surface of the material within a predetermined range by feeding a cutting tool relative to material by the desired distance from one end side to the other end side of the material along the center axis, (C) while rotating the material about the center axis, cutting the outer round surface of the material within a predetermined range by feeding the cutting tool relative to the material by the desired distance from the one end side to the other end side of the material along the center axis, and (D) alternately repeating (B) and (C) to finish cutting the material.


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