The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Dec. 17, 2009
Rajen S. Sidhu, Chandler, AZ (US);
Ashay A. Dani, Chandler, AZ (US);
Mukul P. Renavikar, Chandler, AZ (US);
Rajen S. Sidhu, Chandler, AZ (US);
Ashay A. Dani, Chandler, AZ (US);
Mukul P. Renavikar, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Surface-active dopants are added to a portion of a circuit package before a reflow process to promote wetting and reduce the formation of solder bump bridges. The circuit package has a solder element that electrically connects the circuit package to a substrate. A reflow process is performed to attach the solder element to a pad on the circuit package. During the reflow process, the surface-active dopants diffuse to the surface of the solder element and form an oxide passivation layer on the surface of the solder element.