The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Apr. 06, 2011
Haoren Zhuang, Hopewell Junction, NY (US);
Chong Kwang Chang, Suwon, KR;
Alois Gutmann, Poughkeepsie, NY (US);
Jingyu Lian, Hopewell Junction, NY (US);
Matthias Lipinski, Poughkeepsie, NY (US);
Len Yuan Tsou, New City, NY (US);
Helen Wang, LaGrangeville, NY (US);
Haoren Zhuang, Hopewell Junction, NY (US);
Chong Kwang Chang, Suwon, KR;
Alois Gutmann, Poughkeepsie, NY (US);
Jingyu Lian, Hopewell Junction, NY (US);
Matthias Lipinski, Poughkeepsie, NY (US);
Len Yuan Tsou, New City, NY (US);
Helen Wang, LaGrangeville, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Infineon Technologies AG, Neubiberg, DE;
Abstract
Methods for manufacturing semiconductor devices are disclosed. One preferred embodiment is a method of processing a semiconductor device. The method includes providing a workpiece having a material layer to be patterned disposed thereon. A masking material is formed over the material layer of the workpiece. The masking material includes a lower portion and an upper portion disposed over the lower portion. The upper portion of the masking material is patterned with a first pattern. A polymer material is disposed over the masking material. The masking material and the polymer layer are used to pattern the material layer of the workpiece.