The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Jan. 11, 2005
Norifumi Tokuda, Tokyo, JP;
Yuuko Okada, Tokyo, JP;
Norifumi Tokuda, Tokyo, JP;
Yuuko Okada, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
The present invention relates to a semiconductor manufacturing apparatus, and an object of the invention is to prevent breakage and deformation of semiconductor substrates without deteriorating operability in processing. In order to achieve the object, a semiconductor manufacturing apparatus has a stage () on which a semiconductor substrate () is placed, and the stage () has a first metal portion () that is made of metal and that comes in contact with the semiconductor substrate () placed thereon, and an electroconductive elastic-body portion () that is made of an electroconductive elastic body and that comes in contact with the semiconductor substrate () placed thereon. A contaminant () is embedded in the electroconductive elastic-body portion ().