The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2014

Filed:

Aug. 06, 2010
Applicants:

Katsumi Kikuchi, Tokyo, JP;

Yoshiki Nakashima, Tokyo, JP;

Kentaro Mori, Tokyo, JP;

Shintaro Yamamichi, Tokyo, JP;

Inventors:

Katsumi Kikuchi, Tokyo, JP;

Yoshiki Nakashima, Tokyo, JP;

Kentaro Mori, Tokyo, JP;

Shintaro Yamamichi, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 23/522 (2006.01); H01L 21/4763 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes an embedding layer in which one or more semiconductor element(s) is embedded and one or more interconnect layers as well as one or more insulation layers on one or both sides of the embedding layer. The embedding layer includes a woven cloth formed by reinforcement fibers. The woven cloth has an opening on its site embedding the semiconductor element. The opening is arranged so that direction of the reinforcement fibers will have a preset angle with respect to a direction of a side of or a tangent to at least a portion of the opening, the preset angle being other than a square angle or a zero angle (parallelism).


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