The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Dec. 14, 2011
Applicant:
Xianjie Ning, Beijing, CN;
Inventor:
Xianjie Ning, Beijing, CN;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 29/06 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor wafer and a method which are capable of reducing chippings or cracks generated during the die sawing process. The semiconductor wafer comprises a plurality of dies formed on the semiconductor wafer in row and column directions and separated from each other by scribe lane areas, and a passivation layer formed on the plurality of dies and the scribe lane areas, wherein a groove structure is formed in the passivation layer. The groove structure includes grooves formed along the scribe lane areas, and corners of the passivation layer at intersections of the grooves being removed.