The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
May. 30, 2012
Applicants:
Ying-nan Wen, Hsinchu, TW;
Chien-hung Liu, New Taipei, TW;
Wei-chung Yang, Pingzhen, TW;
Inventors:
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/72 (2006.01);
U.S. Cl.
CPC ...
Abstract
An embodiment of the present invention provides a manufacturing method of an interposer including: providing a semiconductor substrate having a first surface, a second surface and at least a through hole connecting the first surface to the second surface; electrocoating a polymer layer on the first surface, the second surface and an inner wall of the through hole; and forming a wiring layer on the electrocoating polymer layer, wherein the wiring layer extends from the first surface to the second surface via the inner wall of the through hole. Another embodiment of the present invention provides an interposer.