The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Aug. 25, 2009
Applicants:
Takuo Funaya, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Daisuke Ohshima, Tokyo, JP;
Yoshiki Nakashima, Tokyo, JP;
Inventors:
Takuo Funaya, Tokyo, JP;
Shintaro Yamamichi, Tokyo, JP;
Daisuke Ohshima, Tokyo, JP;
Yoshiki Nakashima, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring board is configured by stacking one or more conductor wiring layers and one or more insulating resin layers and comprising one or more metal vias configured to penetrate the insulating resin layer, wherein the boundary surface between the metal via and the insulating resin layer has a concavo-convex boundary cross-section structure in which the metal via and the insulating resin layer are engaged with each other.