The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2014

Filed:

Sep. 09, 2010
Applicants:

Michael Z. Su, Round Rock, TX (US);

Lei Fu, Austin, TX (US);

Gamal Refai-ahmed, Markham, CA;

Bryan Black, Spicewood, TX (US);

Inventors:

Michael Z. Su, Round Rock, TX (US);

Lei Fu, Austin, TX (US);

Gamal Refai-Ahmed, Markham, CA;

Bryan Black, Spicewood, TX (US);

Assignees:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

ATI Technologies ULC, Markham, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing is provided that includes placing a removable cover on a surface of a substrate. The substrate includes a first semiconductor chip positioned on the surface. The first semiconductor chip includes a first sidewall. The removable cover includes a second sidewall positioned opposite the first sidewall. A first underfill is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed.


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