The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Apr. 22, 2010
Taichi Nakamura, Osaka, JP;
Akio Furusawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Hidetoshi Kitaura, Osaka, JP;
Takahiro Matsuo, Osaka, JP;
Taichi Nakamura, Osaka, JP;
Akio Furusawa, Osaka, JP;
Shigeaki Sakatani, Osaka, JP;
Hidetoshi Kitaura, Osaka, JP;
Takahiro Matsuo, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device of the present invention includes a supporting board, an electrode surface processing layer formed on the supporting board, a semiconductor element, and a solder material containing a first metal composed mainly of bismuth and a second metal having a higher melting point than the first metal and joining the electrode surface processing layer and the semiconductor element, the first metal containing particles of the second metal inside the first metal. The composition ratio of the second metal is higher than the first metal in a region of the solder material corresponding to the center portion of the semiconductor element, and the composition ratio of the second metal is at least 83.8 atomic percent in the region corresponding to the center portion.