The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Mar. 30, 2010
Ji-bin Yang, Okegawa, JP;
Koji Hoshino, Kitamoto, JP;
Kenji Orito, Kitamoto, JP;
Hitoshi Maruyama, Kitamoto, JP;
Ji-bin Yang, Okegawa, JP;
Koji Hoshino, Kitamoto, JP;
Kenji Orito, Kitamoto, JP;
Hitoshi Maruyama, Kitamoto, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
This method for producing an aluminum composite including porous sintered aluminum, includes: mixing aluminum powder with a sintering aid powder containing either one or both of titanium and titanium hydride to obtain a raw aluminum mixed powder; adding and mixing a water-soluble resin binder, water, a plasticizer containing at least one selected from polyhydric alcohols, ethers, and esters, and a water-insoluble hydrocarbon-based organic solvent containing five to eight carbon atoms into the raw aluminum mixed powder to obtain a viscous composition; shape-forming the viscous composition on an aluminum foil or an aluminum plate and causing the viscous composition to foam to obtain a formed object prior to sintering; and heating the formed object prior to sintering in a non-oxidizing atmosphere to obtain an aluminum composite which includes porous sintered aluminum integrally joined onto the aluminum foil or the aluminum plate, wherein when a temperature at which the raw aluminum mixed powder starts to melt is expressed as Tm (° C.), then a temperature T (° C.) of the heating fulfills Tm-10 (° C.)≦T≦685 (° C.).