Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method

Abstract

In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region () thereof is removed, and wherein in order to prevent adherence of the partial region () to be removed a material () preventing adhesion is applied in accordance with the partial region to be removed onto a layer () which adjoins the partial region to be removed, it is provided that the material () preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board () are provided.