The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 25, 2014

Filed:

Jul. 31, 2009
Applicants:

Marcel Broekaart, Theys, FR;

Marion Migette, Grenoble, FR;

Sébastien Molinari, Sassenage, FR;

Eric Neyret, Sassenage, FR;

Inventors:

Marcel Broekaart, Theys, FR;

Marion Migette, Grenoble, FR;

Sébastien Molinari, Sassenage, FR;

Eric Neyret, Sassenage, FR;

Assignee:

Soitec, Bernin, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a method of trimming a structure that includes a first wafer bonded to a second wafer, with the first wafer having a chamfered edge. The method includes a first trimming step carried out over a first depth that includes at least the thickness of the first wafer and over a first width determined from the edge of the first wafer. A second trimming step is then carried out over a second depth that includes at least the thickness of the first wafer and over a second width that is less than the first width.


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