The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Aug. 06, 2008
Applicants:
Toru Nakai, Gifu, JP;
Satoru Kawai, Gifu, JP;
Inventors:
Toru Nakai, Gifu, JP;
Satoru Kawai, Gifu, JP;
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A plating apparatus and method to perform plating in non-through-hole openings or through-hole openings of a printed wiring board having at least either non-through holes or through-holes to form via-hole conductors or through-hole conductors. The plating method contacts a printed wiring board having the non-through holes or through-holes with a plating solution including plating ingredients, and plates metal on a surface of the printed wiring board while making contact with at least a portion of a pliable contact body.