The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
May. 27, 2010
Bing Dang, Chappaqua, NY (US);
Matthew Farinelli, Bronx, NY (US);
John Knickerbocker, Yorktown Heights, NY (US);
Aparna Prabhakar, North White Plains, NY (US);
Robert E. Trzcinski, Rhinebeck, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
Bing Dang, Chappaqua, NY (US);
Matthew Farinelli, Bronx, NY (US);
John Knickerbocker, Yorktown Heights, NY (US);
Aparna Prabhakar, North White Plains, NY (US);
Robert E. Trzcinski, Rhinebeck, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.