The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Dec. 07, 2011
Applicants:
Toshiya Akamatsu, Kawasaki, JP;
Nobuhiro Imaizumi, Kawasaki, JP;
Seiki Sakuyama, Kawasaki, JP;
Keisuke Uenishi, Suita, JP;
Tetsuhiro Nakanishi, Toyonaka, JP;
Inventors:
Toshiya Akamatsu, Kawasaki, JP;
Nobuhiro Imaizumi, Kawasaki, JP;
Seiki Sakuyama, Kawasaki, JP;
Keisuke Uenishi, Suita, JP;
Tetsuhiro Nakanishi, Toyonaka, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.
Quick Actions:
Akamatsu, Toshiya. (2014). Solder, soldering method, and semiconductor device (U.S. Patent No. 8673762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8673762
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile