The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Dec. 12, 2008
Taro Morimura, Chigasaki, JP;
Toru Kikuchi, Chigasaki, JP;
Masanori Hashimoto, Chigasaki, JP;
Shin Asari, Chigasaki, JP;
Kazuya Saito, Chigasaki, JP;
Kyuzo Nakamura, Chigasaki, JP;
Taro Morimura, Chigasaki, JP;
Toru Kikuchi, Chigasaki, JP;
Masanori Hashimoto, Chigasaki, JP;
Shin Asari, Chigasaki, JP;
Kazuya Saito, Chigasaki, JP;
Kyuzo Nakamura, Chigasaki, JP;
Ulvac, Inc., Kanagawa, JP;
Abstract
[Object] To provide a method of producing a thin film transistor superior in productivity and capable of preventing variation in transistor characteristics among devices from occurring to improve carrier mobility, and a thin film transistor. [Solving Means] In a method of producing a thin-film transistor according to the present invention, a solid-state green laser is irradiated onto a channel portion of an amorphous silicon film using a source electrode film and a drain electrode film as masks, thereby improving mobility. Since the channel portion of the amorphous silicon film is crystallized by the irradiation of the solid-state green laser, laser oscillation characteristics can be more stable than in a conventional method that uses an excimer laser. Further, laser irradiation onto a large-size substrate at uniform output characteristics in plane becomes possible, with the result that a variation in crystallinity of channel portions among devices can be avoided. Moreover, since a maintenance cycle of a laser oscillator becomes longer, a downtime cost of the apparatus can be reduced and productivity can be improved.