The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Aug. 02, 2012
Ottmar Geitner, Pentling, DE;
Walter Hartner, Bad Abbach, DE;
Maciej Wojnowski, Munich, DE;
Ulrich Wachter, Regensburg, DE;
Michael Bauer, Undorf, DE;
Andreas Stueckjuergen, Regensburg, DE;
Ottmar Geitner, Pentling, DE;
Walter Hartner, Bad Abbach, DE;
Maciej Wojnowski, Munich, DE;
Ulrich Wachter, Regensburg, DE;
Michael Bauer, Undorf, DE;
Andreas Stueckjuergen, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.