The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2014

Filed:

Sep. 23, 2011
Applicants:

Xiaotian Zhang, San Jose, CA (US);

Hamza Yilmaz, Saratoga, CA (US);

Jun LU, San Jose, CA (US);

Xiaoguang Zeng, Songjiang, SG;

Ming-chen LU, Songjiang, CN;

Inventors:

Xiaotian Zhang, San Jose, CA (US);

Hamza Yilmaz, Saratoga, CA (US);

Jun Lu, San Jose, CA (US);

Xiaoguang Zeng, Songjiang, SG;

Ming-Chen Lu, Songjiang, CN;

Assignee:

Alpha & Omega Semiconductor, Inc., Sunnyvale, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a recess area formed in the first chip installation area, and multiple metal pillars formed in the recess area, a notch divides the first chip installation area into a transverse base extending transversely and a longitudinal base extending longitudinally, and separates the recess area into a transverse recess part formed in the transverse base and a longitudinal recess part formed in longitudinal base; a portion of a transverse extending part connecting to an external pin extends into a portion inside of the notch.


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