The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
May. 18, 2007
Akira Suzuki, Gunma, JP;
Katsuyuki Seki, Gunma, JP;
Koujiro Kameyama, Gunma, JP;
Takahiro Oikawa, Gunma, JP;
Akira Suzuki, Gunma, JP;
Katsuyuki Seki, Gunma, JP;
Koujiro Kameyama, Gunma, JP;
Takahiro Oikawa, Gunma, JP;
SANYO Semiconductor Manufacturing Co., Ltd., Ojiya-shi, JP;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
This invention is directed to form a homogeneous film in a via hole formed in a semiconductor device using Bosch process. The via hole that penetrates through a predetermined region in a semiconductor substrate is formed by etching the semiconductor substrate from one of its surface to the other by the Bosch process using a mask layer as a mask. Next, the mask layer is removed. Then, scallops are removed by dry etching to flatten a sidewall of the via hole. Following the above, an insulation film, a barrier layer and the like are formed homogeneously in the via hole.