The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 2014

Filed:

Oct. 25, 2008
Applicants:

Ho-man Rodney Chiu, San Jose, CA (US);

Daniel O. Clark, Pleasanton, CA (US);

Shaun W. Crawford, San Ramon, CA (US);

Jay J. Jung, Sunnyvale, CA (US);

Youssef A. Loldj, Sunnyvale, CA (US);

Robbert M. Vermeulen, Pleasant Hill, CA (US);

Inventors:

Ho-Man Rodney Chiu, San Jose, CA (US);

Daniel O. Clark, Pleasanton, CA (US);

Shaun W. Crawford, San Ramon, CA (US);

Jay J. Jung, Sunnyvale, CA (US);

Youssef A. Loldj, Sunnyvale, CA (US);

Robbert M. Vermeulen, Pleasant Hill, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01); B01D 47/00 (2006.01); B01D 47/06 (2006.01); B01D 53/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for abating effluent from an electronic device manufacturing process is provided, including abating the effluent in a thermal abatement tool to form abated effluent; determining whether the abated effluent contains one or more chemical species of interest; and changing one or more operating parameters of the thermal abatement tool based upon the determination. Numerous other embodiments are provided.


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