The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2014

Filed:

Dec. 22, 2008
Applicants:

Masahiro Takizawa, Nagaoka, JP;

Teruhide Nishino, Yokohama, JP;

Inventors:

Masahiro Takizawa, Nagaoka, JP;

Teruhide Nishino, Yokohama, JP;

Assignee:

ASM Japan K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/67 (2006.01); B25J 13/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor wafer manufacturing apparatus is equipped with a diagnostic module for diagnosing integrity of a transfer robot. The diagnostic module is attached to one side of a semiconductor wafer transfer chamber provided with the transfer robot, which side is also used for the purpose of maintenance, for example. One or more sensors are installed in the diagnostic module so that when the transfer robot is inserted into the diagnostic module, the position or shape of each end effector of the transfer robot is detected and compared against a pre-registered normal condition, thereby diagnosing the integrity of the end effector of the transfer robot, while performing wafer processing.


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