The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2014

Filed:

Jul. 18, 2012
Applicants:

Hiroshi Sunamura, Kanagawa, JP;

Naoya Inoue, Kanagawa, JP;

Kishou Kaneko, Kanagawa, JP;

Inventors:

Hiroshi Sunamura, Kanagawa, JP;

Naoya Inoue, Kanagawa, JP;

Kishou Kaneko, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 29/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

An element using a semiconductor layer is formed between wiring layers and, at the same time, a gate electrode is formed using a conductive material other than a material for wirings. A first wiring is embedded in a surface of a first wiring layer. A gate electrode is formed over the first wiring. The gate electrode is coupled to the first wiring. The gate electrode is formed by a process different from a process for the first wiring. Therefore, the gate electrode can be formed using a material other than a material for the first wiring. Further, a gate insulating film and a semiconductor layer are formed over the gate electrode.


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