The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
Nov. 17, 2009
Shoa Siong Lim, Singapore, SG;
Kian Hock Lim, Singapore, SG;
Shoa Siong Lim, Singapore, SG;
Kian Hock Lim, Singapore, SG;
Advanpack Solutions Pte. Ltd., Kallang, SG;
Abstract
A semiconductor substrate including a carrier, a first conductive layer and a second conductive layer is disclosed. The carrier has a first surface, a second surface, and a concave portion used for receiving a semiconductor element. The first conductive layer is embedded in the first surface and forms a plurality of electric-isolated package traces. The second conductive layer is embedded in the second surface and electrically connected to the first conductive layer. The semiconductor substrate can be applied to a semiconductor package for carrying a semiconductor chip, and combined with a filling structure for fixing the chip. Furthermore, a plurality of the semiconductor substrates can be stacked and connected via adhesive layers, so as to form a semiconductor device with a complicated structure.