The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2014
Filed:
May. 14, 2012
Zvi Or-bach, San Jose, CA (US);
Deepak C. Sekar, San Jose, CA (US);
Brian Cronquist, San Jose, CA (US);
Israel Beinglass, Sunnyvale, CA (US);
Jan Lodewijk DE Jong, Cupertino, CA (US);
Zvi Or-Bach, San Jose, CA (US);
Deepak C. Sekar, San Jose, CA (US);
Brian Cronquist, San Jose, CA (US);
Israel Beinglass, Sunnyvale, CA (US);
Jan Lodewijk de Jong, Cupertino, CA (US);
Monolithic 3D Inc., San Jose, CA (US);
Abstract
A method to construct configurable systems, the method including: providing a first configurable system including a first die and a second die, where the connections between the first die and the second die include through-silicon-via ('TSV'), where the first die is diced from a first wafer using first dice lines; providing a second configurable system including a third die and a fourth die, where the connections between the third die and the fourth die include through-silicon-via ('TSV'), where the third die is diced from a third wafer using third dice lines; and processing the first wafer and the third wafer utilizing at least 20 masks that are the same; where the first dice lines are substantially different than the third dice lines, and where the second die includes a configurable I/O to connect the first configurable system to external devices.