The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Oct. 05, 2012
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Hung-Yi Liu, Pingjhen, TW;
Chung-Hsing Wang, Baoshan Township, TW;
Chih-Chieh Chen, Jia-an Village, TW;
Jian-Yi Li, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of inserting dummy metal and dummy via in an integrated circuit design. The method includes inserting, by a computer, dummy metals using a place and route tool, wherein the place and route tool has timing-awareness to improve a timing performance of the integrated circuit design. The method further includes inserting, by the computer, dummy vias using a design-rule-checking utility separately from the inserting of the dummy metals, wherein at least one of the dummy vias has a different size than at least another of the dummy vias.