The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
Nov. 30, 2010
John Eric Tkaczyk, Delanson, NY (US);
Lowell Scott Smith, Niskayuna, NY (US);
Charles Edward Baumgartner, Niskayuna, NY (US);
Robert Gideon Wodnicki, Niskayuna, NY (US);
Rayette Ann Fisher, Niskayuna, NY (US);
Charles Gerard Woychik, Niskayuna, NY (US);
Robert Stephen Lewandowski, Amsterdam, NY (US);
John Eric Tkaczyk, Delanson, NY (US);
Lowell Scott Smith, Niskayuna, NY (US);
Charles Edward Baumgartner, Niskayuna, NY (US);
Robert Gideon Wodnicki, Niskayuna, NY (US);
Rayette Ann Fisher, Niskayuna, NY (US);
Charles Gerard Woychik, Niskayuna, NY (US);
Robert Stephen Lewandowski, Amsterdam, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A method for forming a tileable detector array is presented. The method includes forming a detector module, where forming the detector module includes providing a sensor array having a first side and a second side, where the sensor array includes a first plurality of contact pads disposed on the second side of the sensor array, disposing the sensor array on an interconnect layer, where the interconnect layer includes a redistribution layer having a first side and a second side, where the redistribution layer includes a second plurality of contact pads disposed on the first side, an integrated circuit having a plurality of through vias disposed therethrough, where a first side of the integrated circuit is operationally coupled to the second side of the redistribution layer, where the sensor array is disposed on the interconnect layer such that the first plurality of contact pads on the second side of the sensor array are aligned with the second plurality of contact pads on the first side of the redistribution layer, operationally coupling the first plurality of contact pads on the second side of the sensor array to the second plurality of contact pads on the redistribution layer to form a sensor stack, coupling the sensor stack to a substrate to form the detector module, and tiling a plurality of detector modules on a second substrate to form the tileable detector array.