The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2014
Filed:
May. 16, 2012
Naoyuki Koizumi, Nagano, JP;
Akihiko Tateiwa, Nagano, JP;
Naoyuki Koizumi, Nagano, JP;
Akihiko Tateiwa, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A semiconductor device includes a wiring substrate, and a semiconductor chip, wherein the wiring substrate includes a glass plate having an opening portion penetrating through a first surface of the glass plate to a second surface of the glass plate, a resin portion penetrating through the first surface to the second surface, and a through wiring penetrating through the resin portion from the first surface to the second surface to electrically connect a first wiring layer formed on a side of the first surface with a third wiring layer formed on a side of the second surface, wherein the semiconductor chip is accommodated inside the opening portion.