The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Nov. 30, 2009
James Jian Zhang, Folsom, CA (US);
Jason Brand, Placerville, CA (US);
Jacob Brooksby, Folsom, CA (US);
Dejen Eshete, Mesa, AZ (US);
Myung Jin Yim, Chandler, AZ (US);
Ravikumar Adimula, Chandler, AZ (US);
Dan Graves, Folsom, CA (US);
James Jian Zhang, Folsom, CA (US);
Jason Brand, Placerville, CA (US);
Jacob Brooksby, Folsom, CA (US);
Dejen Eshete, Mesa, AZ (US);
Myung Jin Yim, Chandler, AZ (US);
Ravikumar Adimula, Chandler, AZ (US);
Dan Graves, Folsom, CA (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, including a die and an encapsulant material formed over the die, and at least one topological feature formed on an external surface of the encapsulant material, and configured to resist out-of-plane deformation of the package. Other embodiments may be described and claimed.