The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Dec. 16, 2009
Applicants:
Harry Chandra, Phoenix, AZ (US);
Robert J. Martin, Iii, Salida, CA (US);
Inventors:
Harry Chandra, Phoenix, AZ (US);
Robert J. Martin, III, Salida, CA (US);
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a base assembly having a cavity and a through conductor adjacent to the cavity; connecting a first device to the base assembly with the first device within the cavity; connecting a second device to the base assembly with the second device within the cavity; and connecting an interposer substrate having an exposed external side over the through conductor with the exposed external side facing away from the through conductor and exposed to ambient.