The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8652350 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 18, 2014

Filed:

Feb. 06, 2009
Applicants:

Kazuo Nishimoto, Yokkaichi, JP;

Tomotaka Shinoda, Koto-ku, JP;

Inventors:

Kazuo Nishimoto, Yokkaichi, JP;

Tomotaka Shinoda, Koto-ku, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains, (B) an organic acid, and (C1) copper ions or (C2) at least one kind of metal atoms selected from Ta, Ti, and Rb, the chemical mechanical polishing aqueous dispersion including the copper ions (C1) at a concentration of 1×10to 2×10ppm, or including the at least one kind of metal atoms (C2) selected from Ta, Ti, and Rb at a concentration of 1×10to 1×10ppm.


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Nishimoto, Kazuo. (2014). Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method using the same, and method of recycling chemical mechanical polishing aqueous dispersion (U.S. Patent No. 8652350). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8652350

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