The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Mar. 18, 2010
Victor Sidorov, Berlin, DE;
Rimma Zhytnytska, Berlin, DE;
Joachim Wuerfl, Zuethen, DE;
Forschungsverbund Berlin E.V., Berlin, DE;
Abstract
The invention relates to a method for producing a metallization for at least one contact pad and a semiconductor wafer having metallization for at least one contact pad. The invention relates to a metallization (and a semiconductor wafer having corresponding metallization) and to a method for the production thereof that first of all can be produced by means of physical gas phase separation (dry separation) and secondly ensures sufficient adhesion of a lot bump. The method for producing a metallization () for at least one contact pad () according to the invention comprises the following process steps: applying at least one contact pad () to a substrate (), applying a barrier layer () to the top side of the at least one contact pad () and applying a metallization () to the top side of the barrier layer (), characterized in that the barrier layer () and the metallization () are applied by means of physical separation and that the metallization () is designed as a layer structure having two multiple alternating metallization layers (), wherein the first metallization layer () is made of nickel or an Ni alloy having a layer thickness of less than 500 nm and the second metallization layer () is made of a material that is different than nickel and is electrically conductive.