The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Mar. 30, 2010
Verena Weiskopf, Guntersblum, DE;
Franz Niklaus Windlin, Heidelberg, DE;
Harald Winsel, Freinsheim, DE;
Markus Ruckpaul, Weinheim, DE;
Dirk Wulff, Schifferstadt, DE;
Uwe Duesterwald, Queidersbach, DE;
Ulrike Licht, Mannheim, DE;
Verena Weiskopf, Guntersblum, DE;
Franz Niklaus Windlin, Heidelberg, DE;
Harald Winsel, Freinsheim, DE;
Markus Ruckpaul, Weinheim, DE;
Dirk Wulff, Schifferstadt, DE;
Uwe Duesterwald, Queidersbach, DE;
Ulrike Licht, Mannheim, DE;
BASF SE, Ludwigshafen, DE;
Abstract
A description is given of a process for preparing solutions of radiation-sensitive, free-radically polymerizable organic compounds, where a first starting compound, which has an acid halide group, and a second starting compound, which has an alcoholic hydroxyl group, are esterified with one another in a solvent or in a solvent mixture. The solvent comprises one or more ketones having a boiling point of below 150° C. under atmospheric pressure (1 bar), or the solvent mixture is composed to an extent of at least 50% by weight of said ketones. One of the two starting compounds has at least one radiation-sensitive group and the other of the two starting compounds has at least one ethylenically unsaturated, free-radically polymerizable group. A description is also given of corresponding solutions of radiation-sensitive, free-radically polymerizable organic compounds and of their use for preparing radiation-crosslinkable, free-radically copolymerized copolymers, more particularly for hotmelt pressure-sensitive adhesives or aqueous polymer dispersions.