The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2014

Filed:

May. 31, 2011
Applicants:

James E. Spinar, Clackamas, OR (US);

Richard R. Lynn, Beaverton, OR (US);

Inventors:

James E. Spinar, Clackamas, OR (US);

Richard R. Lynn, Beaverton, OR (US);

Assignee:

Tektronix, Inc., Beaverton, OR (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate.


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