The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Apr. 18, 2011
Naohide Takamoto, Osaka, JP;
Goji Shiga, Osaka, JP;
Fumiteru Asai, Osaka, JP;
Akiyoshi Yamamoto, Osaka, JP;
Tomokazu Takahashi, Osaka, JP;
Naohide Takamoto, Osaka, JP;
Goji Shiga, Osaka, JP;
Fumiteru Asai, Osaka, JP;
Akiyoshi Yamamoto, Osaka, JP;
Tomokazu Takahashi, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.