The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Sep. 22, 2011
Applicants:
Yun-hyeok Im, Yongin-si, KR;
Jong-yeon Kim, Suwon-si, KR;
Tae-je Cho, Yongin-si, KR;
Un-byoung Kang, Hwaseong-si, KR;
Inventors:
Yun-Hyeok Im, Yongin-si, KR;
Jong-Yeon Kim, Suwon-si, KR;
Tae-Je Cho, Yongin-si, KR;
Un-Byoung Kang, Hwaseong-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are a bump structure includes a first bump and a second bump, a semiconductor package including the same, and a method of manufacturing the same. The bump structure includes: first bump provided on a connection pad of a substrate, the first bump including a plurality of nano-wires extending from the connection pad and a body connecting end portions of the plurality of nano-wires; and a second bump provided on the body of the first bump.