The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Dec. 15, 2010
Glenn A. Rinne, Apex, NC (US);
Kevin Engel, Gilbert, AZ (US);
Julia Roe, Hillsborough, NC (US);
Christopher John Berry, Chandler, AZ (US);
Glenn A. Rinne, Apex, NC (US);
Kevin Engel, Gilbert, AZ (US);
Julia Roe, Hillsborough, NC (US);
Christopher John Berry, Chandler, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.