The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Apr. 09, 2008
Applicants:
Terry Lee Sterrett, Cave Creek, AZ (US);
Richard J. Harries, Chandler, AZ (US);
Inventors:
Terry Lee Sterrett, Cave Creek, AZ (US);
Richard J. Harries, Chandler, AZ (US);
Assignee:
Micorn Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.
Sterrett, Terry. (2014). Interconnection designs and materials having improved strength and fatigue life (U.S. Patent No. 8642462). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8642462
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile