The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Sep. 09, 2012
Yuping Gong, Songjiang, CN;
Yan Xun Xue, Los Gatos, CA (US);
Ping Huang, Songjiang, CN;
Alpha & Omega Semiconductor, Inc., Sunnyvale, CA (US);
Abstract
A wafer-level semiconductor package method comprising the step of providing a first wafer comprising a plurality of first dies each having a first, a second and a third electrodes formed on its front surface; attaching a second die having a fourth and a fifth electrodes formed on its front surface and a sixth electrode formed at its back surface onto each of the first die of the first wafer with the sixth electrode at the back surface of the second die attached and electrically connected to the second electrode at the front surface of the first die; and cutting the first wafer to singulate individual semiconductor packages.