The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Aug. 09, 2011
Applicant:
Daoqiang LU, Chandler, AZ (US);
Inventor:
Daoqiang Lu, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A technique to fabricate a package. A thin wafer supported by a wafer support substrate (WSS) is formed. The WSS-supported thin wafer layer is diced into a plurality of WSS-supported thin dice. A WSS-supported thin die is bonded to a first heat spreader (HS) to form a HS-reinforced thin die.
Quick Actions:
Lu, Daoqiang. (2014). Heat spreader as mechanical reinforcement for ultra-thin die (U.S. Patent No. 8642386). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8642386
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile