The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2014

Filed:

Jun. 07, 2010
Applicants:

Wei Zhang, Netown, PA (US);

Hua Tan, Princeton Junction, NJ (US);

Stephen Y. Chou, Princeton, NJ (US);

Inventors:

Wei Zhang, Netown, PA (US);

Hua Tan, Princeton Junction, NJ (US);

Stephen Y. Chou, Princeton, NJ (US);

Assignee:

Nanonex Corporation, Monmouth Junction, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/46 (2006.01); B29C 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mold for imprinting a patterned region by imprint lithography is provided with a peripheral groove around the patterned region. The groove is connected, as by channels through the mold, to a switchable source for gas removal to prevent bubbles and for the application of pressurized gas to separate the mold and substrate. In use, the mold is disposed adjacent the moldable surface and gas is withdrawn from the patterned region through the groove as the mold is pressed toward and into the moldable surface. At or near the end of the imprinting, the process is switched from removal of gas to the application of pressurized gas. The pressurized gas passes through the groove and separates or facilitates separation of the mold and the moldable surface.


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